Information for Authors


 

Manuscript Preparation

ICVES2019 welcomes contributions within the scope and topics listed in the Call for Papers. While preparing your manuscript, please do follow the formatting guidelines standard of IEEE available here and listed below.

Manuscript Guidelines

  • Language: English
  • Paper size: US Letter
  • Paper format: Two-column format in the IEEE style
  • Page limit: For the initial submission, a manuscript can be 6-8 pages. For the final submission, a manuscript should be 6 pages, with 2 additional pages allowed, but at an extra charge (100 Euro per page)
  • Abstract limit: 300 words
  • File format: A single PDF file, please limit the size of the PDF file to be 10 MB
  • Compliance: Check PDF eXpress compliance

You should use the provided templates:

Note that reviews are for full papers, so please upload the full version of the paper, not an abstract version.

 


 

Paper Submission

All papers must be submitted electronically in PDF format adhering to the guidelines above no later than 23:59:00 (Central European Summer Time) on May 25, 2019 via EDAS. You may also submit a video as supplementary material along with your manuscript, for instance to demonstrate your experimental results; the video attachment must be submitted no later than 23:59:00 (Central European Summer Time) on May 26, 2019 via EDAS, which will guide you through the submission process.

 


 

 

Multimedia Attachment Submission (Optional) 

Authors are encouraged to include a single optional video, e.g., to show experimental results. Videos of accepted papers will be included in the ICVES2019 proceedings and Xplore.

The attachment must be in one of the following formats: mov, mpg, mpeg, or mp4. The resolution can be chosen freely. The file size is limited to 50MB. Videos should not use special codecs (coders/decoders) in order to provide as much portability across platforms as possible. Any other extensions is not recommended. The video contributions should not have any commercial pitch and the authors of each video must have clear copyright of the visual and audio content.

You may upload the attachment during submission of the paper or do this later by logging in as corresponding author of the paper and following the appropriate link. The submission deadline of the multimedia attachment is May 26, 2019.

 


 

Reviewing Process

Each manuscript submitted to ICVES2019 will undergo a peer-reviewing process by at least two members of the International Program Committee. Contributions will be reviewed according to relevance, originality and novel ideas, technical soundness and quality of presentation.

Authors of accepted papers must follow and carefully consider reviewers’ comments, guidelines, and suggestions during the preparation of their camera-ready version for inclusion in the workshop proceedings in a digital format.

 


 

Plagiarism and Excessive Re-use of Earlier Material

The content of any submissions should be original and must not be submitted simultaneously for consideration towards publication in any other conference or journal. All submissions will be checked against (self-)plagiarism using the iThenticate tool provided by IEEE. Possible violations will be reported to IEEE for further investigation.

​The similarity index does not reflect iThenticate assessment of whether a paper has or has not been plagiarized. Similarity Reports are simply a tool to help our editorial board find sources that contain text similar to the submitted documents. The similarity score is a “cumulative” sum of similarity scores with all documents in the CrossCheck database and as such a high similarity does not automatically imply plagiarism (for example you may be using segments from a technical report of yours). The decision to deem any work plagiarized is made carefully and only after an in-depth examination of both the submitted paper and sources that have similar text.

 


 

Proceedings Publication

Accepted papers will be included in the conference proceedings in a digital format and will be indexed in the IEEE Xplore Digital Library.